Enhance your solutions with
All functionalities of the X-AID framework are accessible from a fully documented C++ API. The libraries enable system integrators to quickly develop own software solutions or integrate new features into existing software. OEM partners can thereby benefit from the broad range of possibilities, the fast processing speeds and the high data quality that X-AID provides.
Special solutions and customized developments
2.5D Imaging methods
Flat objects like circuit boards are not perfectly suited for CT examination. If a conventional 2D radiographic examination is not sufficient for a certain inspection task, the 2.5D techniques still allow for producing cross-sectional images through the object. All procedures have in common that the object is as usually positioned between X-ray source and detector, but each component is at the same side of the object during the complete data acquisition. As opposed to CT imaging, the object is not irradiated from all directions and other data processing algorithms are needed to calculate the final images.
Advanced CT acquisition
A standard CT scan comprises hundreds or thousands of radiographic images that are recorded during a 360 degree rotation of the object. The exposure time for each image and the angular rotation of the sample manipulator in between two subsequent images remain unchanged during the acquisition. However, depending on the geometry of the object and its inner features, a different sampling strategy might be favorable and lead to enhanced image quality. For high aspect ratio objects like battery cells, smaller angular steps and, thus, more radiographic images from the narrow side of the object and less images from the broadside can improve the final results and even speed up the scanning process.
Novel X-ray techniques
Driven by the progress in medical diagnostics, the manifold developments in the area of X-ray imaging open up great chances for new inspection tasks in the future. The increased contrast that can be obtained by phase-sensitive methods will boost the application of nano CT. The use of multi-energy data acquisition will improve the characterization and determination of certain materials within an object. The additional information will further help to correct for certain CT image artifacts. The so-called dark-field imaging will be able to spot micro-structural defects smaller than the actual detector resolution and, thus, within larger objects.